Hon Hai to Invest in Czech
TAIPEI, Taiwan — After an invest plan in India, Hon Hai Precision Industry Co. is reportedly to sign a memorandum in collaboration with the Czech Republic later this month related to an investment in a research and design center in that nation...
Taiwan Tops Fab Spending ─ Driving Anticipation for SEMICON Taiwan 2015
TAIPEI, Taiwan – In 2015, Taiwan is projected to have the highest capex for semiconductor manufacturing worldwide. Taiwan’s aggressive semiconductor factory plans are bringing exhibitors and attendees to SEMICON Taiwan 2015 on September 2-4 at the TWTC Nangang Exhibition Hall...
ASUS Announces World’s First TV Tablet "ZenPad" with 4GB RAM
TAIPEI, Taiwan － Asus unveiled yesterday a new series of tablet named “Asus ZenPad”, to be available in Taiwan today. The new tablet, featuring 4GB RAM, high-end TV level GPU, HD IPS display, ASUS Tru2Life visual enhancement technology and DTS-HD Premium Sound, aims to satisfy the eagerness for high-quality mobile video...
Advantech: Industry 4.0 Has Become a Global Trend
TAIPEI, Taiwan － Taiwanese industrial computer supplier Advantech stated that countries all around the world are actively investing in Industry 4.0, the robotics industry, and automated technologies, and it has become a global trend...
HP, NEC Collaborate to Advance Adoption of Network Functions Virtualization
At Mobile World Congress Shanghai, HP and NEC announced the two companies will collaborate to accelerate communications service provider (CSP) adoption of network functions virtualization (NFV) technology. NFV offers a new way for CSPs to design, deploy, and manage networking services...
Imec, SPTS Collaborate on Critical Processes for 3D IC Wafer Stacking
imec and SPTS Technologies, an Orbotech company and supplier of advanced wafer processing solutions for the global semiconductor and related industries, announced at SEMICON West that they are jointly developing a highly accurate, short cycle-time dry silicon removal and low temperature passivation solution for through-silicon via-middle processing and thinning of the top-wafer in wafer-to-wafer bonding...
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