Micron and Intel Unveil New 3D NAND Flash Memory; Achieves 384GB TLC
Micron Technology and Intel Corporation today revealed the availability of their 3D NAND technology, the world's highest-density flash memory. Flash is the storage technology used inside the lightest laptops, fastest data centers, and nearly every cellphone, tablet and mobile device...
UMC Xiamen 12-Inch Fab Holds Groundbreaking, Qualcomm President Attends
TAIPEI, Taiwan － According to Taiwan's Economic Daily News reported, the subsidiary of United Microelectronics Corporation(UMC) in Xiamen, China, held its 12-inch fab groundbreaking ceremony yesterday, Qualcomm president Derek Aberle personally attend the event...
Imec Demonstrates 50GHz Ge Waveguide Electro-Absorption Modulator
At this week’s OFC 2015, nanoelectronics research center imec, its associated lab at Ghent University (Intec), and Stanford University have demonstrated a compact germanium (Ge) waveguide electro-absorption modulator (EAM) with a modulation bandwidth beyond 50GHz...
Intel Unveils Next-Gen Industrial Solutions System Consolidation Series
Intel today announced the next generation of the Intel Industrial Solutions System Consolidation Series, offering OEMs, machine builders and system integrators an expanded set of software configurations to simplify the development of industrial solutions using 4th generation Intel Core vPro processor-based platforms...
Hon Hai and SK C&C Signes A Global IT services collaboration Agreement
TAIPEI, Taiwan － Hon Hai / Foxconn Technology Group today announced the signing of a strategic cooperation agreement with the Korean company SK C&C, the two sides will jointly manage the joint venture company, to expand IT services in China...
HTC to Feature Wireless Charging in The Next Flagship Model
TAIPEI, Taiwan — In response to its rival Samsung’s Galaxy S6 and S6 Edge have featured the wireless charging function, Taiwanese handset maker HTC forecast that soonest they will feature the same function in its next flagship model...
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