Infineon Technologies AG launches a new family of discrete IGBTs. The new RC-E devices are cost optimized and specifically meet the demands of low- to mid-price range induction cookers and induction rice cookers. (圖一) The new RC-E family features an IGBT with monolithically integrated reverse conduction diode for resonant switching...

STMicroelectronics (STM) introduced its new record-breaking STM32H7 series of microcontrollers, which embeds the highest SRAM memory (1Mbytes), Flash memory up to 2MB, and the richest connectivity peripheral set ever seen in the STM32 platform...

STMicroelectronics (STM) introduced its new record-breaking STM32H7 series of microcontrollers, which embeds the highest SRAM memory (1Mbytes), Flash memory up to 2MB, and the richest connectivity peripheral set ever seen in the STM32 platform...

PiBond today announced that its SAP’s metal oxide solution revolutionizes the way in which manufacturers deal with ever increasing cost structures resulting from more complex designs. These materials boast higher etch selectivity than anything currently on the market...

PiBond today announced that its SAP’s metal oxide solution revolutionizes the way in which manufacturers deal with ever increasing cost structures resulting from more complex designs. These materials boast higher etch selectivity than anything currently on the market...

Samsung Electronics announced that it is introducing the industry’s first 8-gigabyte (GB) LPDDR4 (low power, double data rate 4) mobile DRAM package, which is expected to greatly improve mobile user experiences, especially for those using Ultra HD, large-screen devices...

Samsung Electronics announced that it is introducing the industry’s first 8-gigabyte (GB) LPDDR4 (low power, double data rate 4) mobile DRAM package, which is expected to greatly improve mobile user experiences, especially for those using Ultra HD, large-screen devices...