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CAPZero X-Capacitor Discharge ICs Certified to New IEC 62368 Standard for TV & IT Equipment
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Published: Sep 11,2014
Industry’s First Global Navigation and Sensor Hub Combo Chip
Broadcom Corporation announced the industry’s first low-power Global Navigation Satellite System (GNSS) and sensor hub combo chip to deliver new always-on location applications for a full range of mobile devices. The Broadcom BCM4773 minimizes battery drain and adds a new layer of intelligence to location technology on mobile devices by integrating the GNSS chip and sensor hub into a single combo chip...
17-inch Fanless Multi Touch Panel Computer with Intel Bay Trail-D Celeron Processor
Axiomtek has announced the arrival of the GOT3177T-834, its newest 17-inch SXGA, fanless, multi-touch panel computer powered by Intel Bay Trail-D Celeron processor. This all-in-one industrial-touch panel PC is equipped with a 5:4 aspect ratio flush, flat resistive touch panel or projected capacitive touch panel with 350nits brightness...
Ultra-Low Power Conversion for Wearable, Sensor and Industrial Designs
Delivering power management innovation for ultra-low power designs, Texas Instruments (TI) introduced the industry's smallest, lowest power linear battery charger and a tiny, fully integrated DC/DC power module, which consumes only 360 nA of quiescent current, to help extend battery run-time in wearable electronics, remote sensors and MSP430 microcontroller-based applications...
New Snapdragon 210 and 208 Processors for Low cost Devices
Qualcomm announced the Snapdragon 210 processor, making 4G LTE available in this class of processors for the first time. Realizing 3G is as ubiquitous, the company is also announcing a 3G-only variant called the Snapdragon 208...
Integrated DrMOS Power Stages Deliver High Current, Efficiency, and Power Density
Vishay Intertechnology, Inc. introduced a new family of VRPower integrated DrMOS power stage solutions in the low-profile, thermally enhanced PowerPAK MLP 5 mm by 5 mm 31-pin package. Delivering currents in excess of 60 A per phase, Vishay Siliconix SiC620 devices are 30 % smaller than previous-generation 6 mm by 6 mm power stages while enabling 3 % higher efficiency to 95 % peak...
SoC Hybrid Direct Broadcast Satellite Terrestrial and IP Devices for STB with HEVC and MoCA 2.0
Broadcom Corporation announced the world's first family of eight new hybrid satellite and terrestrial system-on-a-chip (SoC) broadcast devices for set-top boxes (STBs). The new series is engineered with pin-to-pin compatibility, allowing a single set-top design to be leveraged across the entire family...
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