Published: Feb 25,2014
TAIPEI, TAIWAN — Cadence Design Systems, Inc., a leader in global electronic design innovation, introduced the Tensilica Imaging and Video Processor-Enhanced Performance (IVP-EP) core, the latest imaging and video dataplane processor in the IVP product line...
Qualcomm Incorporated today announced that has added the Qualcomm Snapdragon 610 and 615 chipsets to the Snapdragon 600 tier for high-end mobile computing devices. Both new chipsets integrate Qualcomm Technologies’ 3rd Generation LTE modem, supporting Category 4 data rates for new requirements such as LTE-Broadcast and LTE Dual SIM Dual Active (DSDA)...
Xilinx Smarter Solutions for Radio enable wireless infrastructure vendors to deliver optimal, cost effective and energy efficient radio solutions that provide seamless support for multi-standard, multi-mode heterogeneous networks...
Texas Instruments introduced the industry's fastest 12-bit analog-to-digital converter (ADC). The RF-sampling ADC12J4000 clocks in at 4 GSPS and supports the JEDEC JESD204B serial interface standard for data converters up to 8 Gbps, while consuming 50 percent less power than competitive devices...
Spansion Inc. announced Spansion HyperBus Interface, a breakthrough that dramatically improves read performance while reducing the number of pins. The Spansion HyperBus Interface is being implemented broadly by leading system-on-chip (SoC) manufacturers...
ZyXEL Communications announced that it will showcase the FMT3251, the company´s brand new UMTS small cell CPE with Wi-Fi at the Mobile World Congress (MWC) on February 24-27, 2014. The FMT3251 is the world´s first UMTS femtocell CPE compatible with the latest 802...
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