- AAEON to Present Its AI Edge Technology at Embedded World 2018
2018.02.23 08:34:36 /
- Intel and Unigroup Spreadtrum & RDA Announce 5G Strategic Collaboration
2018.02.23 08:30:41 /
- Fingerprint Cards Launches The Third-generation Fingerprint Sensor
2018.02.22 14:26:05 /
- Posiflex Showcases New Line of Touch Screen Terminals and Self-Service Kiosks at EuroCIS 2018
2018.02.22 13:55:58 /
Renesas Electronics today announced three new Target Boards for the RX65N, RX130 and RX231 Microcontroller (MCU) Groups, each designed to help engineers jump start their home appliance, building and industrial automation designs...
Samsung Electronics announced that it has begun mass producing the industry’s largest capacity Serial Attached SCSI (SAS) solid state drive (SSD) – the PM1643 – for use in next-generation enterprise storage systems. Leveraging Samsun...
Holtek announces the release of its new sensor measurement device, the BH45B1224. This new device includes an internal 24-bit Delta Sigma A/D converter which has the characteristics of high RF noise immunity and a wide operating voltage of ...
u blox announced that its SARA cellular module series will provide wireless connectivity for a new end-to-end platform for Industry 4.0. With the platform, developed by Italian-based Iomote, businesses will be able to easily connect existin...
Renesas Electronics announced two new fully encapsulated digital DC/DC PMBus power modules that deliver the highest power density and efficiency in their class. The dual ISL8274M operates from a 5V or 12V power rail, provides two 30A output...
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