
Microchip Releases New PIC16F19197 family Low-power MCUs for LCD
A new family of low-power microcontrollers (MCUs) for driving Liquid Crystal Displays (LCD) featuring Core Independent Peripherals (CIPs) and intelligent analog is now available from Microchip Technology. The nine-member PIC16F19197 family includes a battery-friendly LCD drive charge pump, 12-bit Analog-to-Digital Converter with computation (ADC), a low-power comparator and active clock tuning of its high-frequency oscillator...

HEX Taiwan Announces Drone Navigation Kit with u-blox RTK GNSS Module
u blox today announced that its NEO M8P high precision RTK GNSS module is featured in HEX Taiwan’s new drone navigation kit: Here+. HEX is the world's leading open source hardware manufacturer which produces one of the best open source drone autopilots in the world...

WD to Deliver World’s First Client SSD with 64-Layer 3D NAND Technology
Western Digital Corporation announced the world’s first client solid state drives built with its 64-layer 3D NAND technology. This technology milestone enables the company to deliver new, innovative SSDs with lower power consumption and higher performance, endurance and capacities...

Industry’s First MCU with Integrated 2D GPU and DDR2 Memory
The 32-bit PIC32MZ DA microcontroller (MCU) family is the industry’s first MCU with an integrated 2D Graphics Processing Unit (GPU) and up to 32 MB of integrated DDR2 memory. This combination from Microchip Technology giv...

Samsung SDI to Unveil New Residential ESS Products for Global Market
Samsung SDI is unveiling new residential ESS (Energy Storage System) products that use differentiated design technology in a move to gain a competitive edge in the market. A residential ESS is a battery system installed at home...

Toshiba Unveils NVMe SSDs Using 64-Layer, 3D Flash Memory
Toshiba Memory Corporation launched the XG5 series, a new line of NVM Express (NVMe) SSDs integrating 64-layer, 3D flash memories, with a maximum capacity of 1024GB in a thin single-sided form factor. Sample shipments to OEM customers start today in limited quantities, and Toshiba will gradually increase shipments from the third calendar quarter of this year...
Top Stories
Most Popular
- 1STM Reveals New Antenna-matching RF Integrated Passive Devices for STM32WL MCUs
- 2HOLTEK HT32 Series Conforms to the UL/IEC 60730-1 Class B Software Security Certification
- 3u-blox’s Newest Module Stands Temperatures up to 105 °C for Advanced Automotive Applications
- 4u-blox Introduces the Smallest LTE-M/NB-IoT Module with 23dBm RF Output Power
- 5Toshiba Launches 100V High-Current Photorelay for Industrial Equipment
- 6u-blox Extends Reach of Secure LTE-M, NB-IoT Module with 400MHz Support
- 7VIAVI First to Introduce RedCap Device Emulation, Boosting 5G IoT Commercialization
- 8DKSH Partners with Life Science Innovator Nicoya in Asia
- 9HOLTEK New BP66FW1242 Wireless Charger Rx MCU
- 10World’s Smallest Plug-and-play NFC Security Module