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Toshiba's New ICs for Bluetooth Smart Devices

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Published: May 31,2017

 

Microchip Releases New PIC16F19197 family Low-power MCUs for LCD

A new family of low-power microcontrollers (MCUs) for driving Liquid Crystal Displays (LCD) featuring Core Independent Peripherals (CIPs) and intelligent analog is now available from Microchip Technology. The nine-member PIC16F19197 family includes a battery-friendly LCD drive charge pump, 12-bit Analog-to-Digital Converter with computation (ADC), a low-power comparator and active clock tuning of its high-frequency oscillator...

HEX Taiwan Announces Drone Navigation Kit with u-blox RTK GNSS Module

u blox today announced that its NEO M8P high precision RTK GNSS module is featured in HEX Taiwan’s new drone navigation kit: Here+. HEX is the world's leading open source hardware manufacturer which produces one of the best open source drone autopilots in the world...

WD to Deliver World’s First Client SSD with 64-Layer 3D NAND Technology

Western Digital Corporation announced the world’s first client solid state drives built with its 64-layer 3D NAND technology. This technology milestone enables the company to deliver new, innovative SSDs with lower power consumption and higher performance, endurance and capacities...

Industry’s First MCU with Integrated 2D GPU and DDR2 Memory

The 32-bit PIC32MZ DA microcontroller (MCU) family is the industry’s first MCU with an integrated 2D Graphics Processing Unit (GPU) and up to 32 MB of integrated DDR2 memory. This combination from Microchip Technology giv...

Samsung SDI to Unveil New Residential ESS Products for Global Market

Samsung SDI is unveiling new residential ESS (Energy Storage System) products that use differentiated design technology in a move to gain a competitive edge in the market. A residential ESS is a battery system installed at home...

Toshiba Unveils NVMe SSDs Using 64-Layer, 3D Flash Memory

Toshiba Memory Corporation launched the XG5 series, a new line of NVM Express (NVMe) SSDs integrating 64-layer, 3D flash memories, with a maximum capacity of 1024GB in a thin single-sided form factor. Sample shipments to OEM customers start today in limited quantities, and Toshiba will gradually increase shipments from the third calendar quarter of this year...

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