Technology front
Simplicity Studio Development Platform Features a New Real-Time Energy Profiler Tool
By
Published: Jul 21,2015
Rugged Reliable IR7xxxS Series of 700 V HVICs
Infineon Technologies AG announced the introduction of a family of rugged, reliable 700 V High-Voltage ICs (HVICs) optimized for solar, power supply, uninterruptible power supplies (UPS), welding and industrial drive applications...
PIC MCU Families With Core-Independent Peripherals
Microchip Technology Inc announced from ESC Silicon Valley two new 8-bit families that expand its growing portfolio of innovative PIC MCUs with Core-Independent Peripherals (CIPs). 8-bit MCUs can now be used in a much broader range of applications...
New Rugged and Expandable Panel PC Series, ARC-1209 and ARC-1509
Avalue Technology is unveiling a new rugged and expandable panel pc, ARC-1209 and ARC-1509. ARC series is a new product line which stands for advanced ruggedized and expandable panel PC. The ARC series is an ideal solution for industrial automation, home automation and human machine interface applications...
16 MP CMOS Image Sensor for Smartphones and Tablets
Toshiba Corporation announced the launch of “T4KC3”, a 16 megapixel(MP) BSI CMOS image sensor. Sample shipments are scheduled to start in September this year. In the mobile device market, manufacturers constantly target a small form factor; a thinner final product...
The Smallest Development Kit in R-Car History
Renesas Electronics introduced the smallest R-Car-based development kit to date—the ADAS Starter Kit—based on Renesas' high-end R-Car H2 System on Chip (SoC) and developed to help simplify and speed up the development of advanced driver assistance systems (ADAS) applications...
Reflowable, Low Impedance Chip-Type Capacitor
Seiko Instruments Inc. (SII) announcedthat it is expanding its lineup of chip-type Electric Double Layer Capacitor (EDLC). The products are CPX10080C104F (hereinafter, “CPX104”), CPZ10080C104F (hereinafter, “CPZ104”) , and CPX10080C402F (hereinafter, “CPX402”)...
Top Stories
Most Popular
- 1STM Reveals New Antenna-matching RF Integrated Passive Devices for STM32WL MCUs
- 2HOLTEK HT32 Series Conforms to the UL/IEC 60730-1 Class B Software Security Certification
- 3u-blox’s Newest Module Stands Temperatures up to 105 °C for Advanced Automotive Applications
- 4u-blox Introduces the Smallest LTE-M/NB-IoT Module with 23dBm RF Output Power
- 5Toshiba Launches 100V High-Current Photorelay for Industrial Equipment
- 6u-blox Extends Reach of Secure LTE-M, NB-IoT Module with 400MHz Support
- 7VIAVI First to Introduce RedCap Device Emulation, Boosting 5G IoT Commercialization
- 8DKSH Partners with Life Science Innovator Nicoya in Asia
- 9HOLTEK New BP66FW1242 Wireless Charger Rx MCU
- 10World’s Smallest Plug-and-play NFC Security Module
Address: Rm. A204, No. 287-2, Sec. 3, Chengde Rd., Datong Dist., Taipei City , Taiwan (R.O.C.)
Phone:+886 2 2585-5526
E-Mail:en@ctimes.com.tw