Technology front
Extremely Rugged 4th Generation Intel Core-based Fanless Embedded Computer
By
Published: Jun 08,2014
Smartphone Quick-Jack Solution Transforming Audio Jack into Multi-Purpose
NXP Semiconductors N.V. announced a versatile new Smartphone Quick-Jack Solution that simplifies connecting a variety of external devices to smartphones for self-powered data communications. Adapting the standard 3.5mm audio jack found on smartphones, the Solution creates a universal interface for external sensors, switches, peripherals and other devices...
Redefines the IP Supplier Paradigm with New IP Accelerated Initiative
Synopsys, Inc. tannounced the IP Accelerated initiative to help designers significantly reduce the time and effort of integrating IP into their system-on-chips (SoCs). This initiative augments Synopsys' established broad portfolio of silicon-proven DesignWare IP with the addition of new IP Prototyping Kits, IP Virtual Development Kits and customized IP subsystems to accelerate prototyping, software development and integration of IP into SoCs...
Ground-Breaking Technology From Imagination Makes IoT and Cloud More Accessible to Developers
Ground-Breaking Technology From Imagination Makes IoT and Cloud More Accessible Imagination Technologies is making its innovative FlowCloud technology available to developers, including the maker community, hobbyists and students, to speed application development for the Internet of Things (IoT)...
New HT46R002/003 and HT48R002/003 Cost-Effective OTP MCU Series
Holtek announce the release of two new Cost-Effective A/D Type OTP MCUs, the HT46R002 and HT46R003 and two new Cost-Effective I/O Type OTP MCUs, the HT48R002 and HT48R003. The differences between HT46R002/003 and HT48R002/003 are that the former two devices include an embedded 12-bit A/D converter and an 8-bit PWM...
Fast-charge Wireless Power Receivers Cut Power Loss by 50 Percent
Texas Instruments (TI) introduced the industry's most power-efficient 5-watt wireless power receivers that support the Wireless Power Consortium (WPC) Qi 1.1 standard. TI's new bq51020 and bq51021 allow consumers to charge their Qi-compliant mobile phones, tablets, power banks and other electronics faster, cooler and more efficiently compared to other available wireless power solutions...
Multi-Standard Wireless Charging SoC for Smartphones
Broadcom Corporation introduced a new multi-standard smartphone power management unit (PMU) that drives Rezence technology into the mainstream while providing compatibility with existing deployed standards. Broadcom's high performance BCM59350 wireless charging PMU enables automatic selection between specifications from all three leading standards organizations including the Alliance for Wireless Power (A4WP)...
Top Stories
Most Popular
- 1STM Reveals New Antenna-matching RF Integrated Passive Devices for STM32WL MCUs
- 2HOLTEK HT32 Series Conforms to the UL/IEC 60730-1 Class B Software Security Certification
- 3u-blox’s Newest Module Stands Temperatures up to 105 °C for Advanced Automotive Applications
- 4u-blox Introduces the Smallest LTE-M/NB-IoT Module with 23dBm RF Output Power
- 5Toshiba Launches 100V High-Current Photorelay for Industrial Equipment
- 6u-blox Extends Reach of Secure LTE-M, NB-IoT Module with 400MHz Support
- 7VIAVI First to Introduce RedCap Device Emulation, Boosting 5G IoT Commercialization
- 8DKSH Partners with Life Science Innovator Nicoya in Asia
- 9HOLTEK New BP66FW1242 Wireless Charger Rx MCU
- 10World’s Smallest Plug-and-play NFC Security Module
Address: Rm. A204, No. 287-2, Sec. 3, Chengde Rd., Datong Dist., Taipei City , Taiwan (R.O.C.)
Phone:+886 2 2585-5526
E-Mail:en@ctimes.com.tw