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Toshiba Memory Corporation Introduces XL-FLASH Storage Class Memory Solution
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Published: Aug 06,2019
HOLTEK New BP45F4MB Power Bank MCU
Holtek announce the release of its new power bank dedicated MCU, the BP45F4MB, which provides full support for all the required power bank functions. The device includes single lithium battery charging, discharging and power indicator functions...
Renesas Introduces Ultra-Small RX651 32-Bit MCUs for IoT Modules and Space-Constrained Edge Devices
Renesas Electronics announced four new RX651 32-bit microcontrollers (MCUs) supplied in ultra-small 64-pin BGA and LQFP packages. The new lineup expands Renesas’ popular RX651 MCU Group with a 64-pin (4.5mm x 4.5mm) BGA package that reduces footprint size by 59 percent compared to the 100-pin LGA, and a 64-pin (10mm x 10mm) LQFP that offers a 49 percent reduction versus the 100-pin LQFP...
STM32Trust Ecosystem from STMicroelectronics Consolidates Cyber-Protection Resources for IoT Designe
STMicroelectronics has launched STM32Trust to guide designers’ efforts to build strong cyber-protection into new IoT devices leveraging industry best-practices. STM32Trust combines knowledge, design tools, and ready-to-use original ST software...
UnitedSiC Adds 2 New 650V SiC FET Packages to UF3C FAST Series
UnitedSiC has added two new TO220-3L package options to its growing range of hard-switching UF3C FAST series of 650V SiC FETs. The new products offer RDS(on) values of 30mohms (UF3C065030T3S) and 80mohms (UF3C065080T3S). The three-leaded, industry-standard TO220-3L package features enhanced thermal characteristics made possible by a sintered-silver packaging technology developed by UnitedSiC...
HOLTEK New HT66F0181 1.8V Low Voltage A/D MCU
Holtek announced the release of a new device addition to its A/D Flash MCU range, the HT66F0181. This is provided as a streamlined product to the HT66F018 device. This new device has the features of 1.8V low operating voltage and a high-accuracy internal oscillator as well as the integrated large current I/Os which can directly drive LEDs...
New UP Core Plus Modular Boards from AAEON
AAEON announces the 2nd Generation of UP modular boards, the UP Core Plus maker board along with the Net Plus and Vision Plus X docking boards. Together these board kits provide developers and easy way to build a system designed for the needs of their project, whether it’s a compact networking device, or a powerful AI Edge system...
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