Toshiba Expands New Packaging Option for SO6L IC-Output Photocouplers
Toshiba Electronic Devices & Storage Corporation is expanding its line-up of SO6L IC-output photocouplers with a new wide leadform package type SO6L(LF4). Shipments start today. The SO6L(LF4) package has a creepage distance of 8mm, which meets the industry’s standard creepage distance for SO6L...
Samsung Annouces Its New AP Exynos 7 Series 9610
Samsung Electronics announced the availability of its latest application processor (AP), the Exynos 7 Series 9610. The Exynos 9610, built on Samsung’s 10-nanometer (nm) FinFET process, elevates the multimedia experience in high-end smartphones with premium-level features such as deep learning-based image processing for ultimate picture-taking experiences and stunning slow motion video recording at 480 frames per second (fps)...
Marvell Introduces Industry's First NVMe Chipset Solutions
Marvell announced that it is launching innovative NVM Express (NVMe)-based chipset solutions that will accelerate the time to market for application-optimized data center SSD implementations. These new, highly-versatile building blocks can optimally address current and emerging workload storage requirements, spanning capacity, latency, performance, power and cost, to enable tailored SSD solutions for specific cloud and enterprise workloads...
Toshiba Memory Releases Enhanced Data Center SSD Line-up with 64-Layer 3D Flash Memory
Toshiba Memory Corporation announced its latest line-up of NVM Express (NVMe) and SATA data center solid-state drives (SSDs) in multiple form factors. The new SSDs offer cloud data centers robust performance and reliability, and deliver lower operating power for read-intensive applications such as NoSQL databases, big data analytics and streaming media...
HOLTEK New HT69F2562 Ultra-Low Power MCU with LCD & EEPROM
Holtek is delighted to announce the release of its new HT69F2562 Flash MCU, having the special characteristics of ultra-low power and integrated LCD driver circuit. This new device provides an excellent MCU solution for those applications which require ultra-low power consumption in the standby mode but still require an active RTC, such as battery powered consumer products, thermal rewritable cards, NFC data loggers etc...
congatec Powers Luxoft's Modular Next-gen Automotive Reference Platform
congatec and global IT service provider Luxoft introduce a next-gen automotive platform with SMARC 2.0 Computer-on-Modules. Launching with the conga-SA5 as the first official supported module, the Automotive Reference Platform (ARP) co-developed by Intel and Luxoft makes digital cockpit designs of next-generation vehicles smarter...
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