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D-Link Introduces New Generation DGS-3630 Series Layer 3 Stackable Managed Gigabit Switches
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Published: Nov 06,2017
Microsemi Introduces New Smart Storage HBAs and RAID Adapters for Data Centers
Microsemi Corporation announced the production release of its new Smart Storage SAS/SATA adapters. The addition of these advanced Smart Storage adapters advances Microsemi's Smart Storage offering for SAS/SATA server storage in data centers with full board-level solutions as well as silicon plus software for custom embedded solutions...
Holtek New HT32FP2350/2450 USB Power Delivery Fast Charger MCU
Holtek announces the release of two new USB-PD (USB Power Delivery) Fast Charger MCUs, the HT32FP2350 and HT32FP2450. These devices can both implement PD 3.0 communication and can be integrated with power management circuitry and used in products such as car chargers, mobile power banks and many others...
Ultra-Low ICs With an Integrated Schottky Diode Bridge and LDO Regulator XCM414 Series
Torex Semiconductor Ltd. has launched multichip-module power ICs that integrate four Schottky diodes and an LDO regulator. With the increase in recent years of smartcards and other products that are equipped with a thin lithium ion battery or super capacitor, a demand for simple wireless charging has emerged...
USB Smart Hub ICs Enable Smartphone-Connected Automotive Infotainment
Microchip Technology provides unrivaled options with its five new USB 2.0 smart hub ICs. These devices, available in a variety of architectures, offer greatly increased flexibility to fit car manufacturers’ design needs and meet consumer demand for easy-to-use, intuitive systems...
Toshiba Electronic Launches New Surface-Mount Brushed Motor Driver IC
Toshiba Electronic Devices & Storage Corporation has broadened its line-up of small surface-mount brushed motor drivers with the addition of “TB67H420FTG,” which supports high-voltage, large-current drive for home-use robot vacuum cleaners, printers and other office equipment...
congatec Presents Virtualized Fog Server Installation
congatec will be presenting its first robust, fanless, virtualized edge server platform for the extended temperature range at Embedded Conference Scandinavia (ECS) to be held in Stockholm from 7-9 November. The platform supports redundancy as well as real-time collaboration and consists of COM Express Type 7 modules with Intel Atom processors (codename Denverton) and a real-time hypervisor from Real-Time Systems...
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