Tezzaron Announces World’s First Eight-Layer Active Wafer Stack
Today at the IEEE 3DIC conference, Tezzaron Semiconductor and their manufacturing subsidiary, Novati Technologies, announce the world’s first eight-layer 3D IC wafer stack containing active logic. The transistor and interconnect densities per cubic mm are far higher than achievable with 2D 14nm silicon fabrication...
AAEON Enters the 4K Realm with EPIC-BDU7
AAEONunveils the most advanced entry in their EPIC form factor board lineup, the EPIC-BDU7. The EPIC-BDU7 comes equipped with Intel’s 5th Generation Core Processors, delivering high performance at a very low power consumption of 15W...
TOBY-L201, a 150 Mbps 4G LTE and WCDMA module
u-blox announces TOBY-L201, the world’s first 4G LTE Cat 4 module with 3G WCDMA fall-back, which works on AT&T and Verizon networks. TOBY-L201 switches automatically or via AT command to AT&T’s or Verizon’s network, without the need to load new firmware...
Brushless Motor Pre-Driver IC for Automotive EPS
Toshiba Corporation announced the launch of “TB9081FG”, a brushless motor pre-driver IC enhanced to achieve functional safety, for use in electric power steering systems (EPS). Sample shipments will start on September 1st, 2015, with mass production scheduled to start in August, 2017...
HOLTEK BS66FV340/350/360 SoC Flash MCUs
Holtek announced the release of its new Enhanced Touch Key Voice Flash MCUs, the BS66FV340/350/360. These devices integrate the new version enhanced Touch Key Engine (V3.2), which with its hardware acceleration circuit, has enhanced the Touch Key algorithm efficiency...
Flexible & Cableless 2.5” Pico-ITX SBC MIO-3260
Advantech launched its latest 2.5” MI/O-Ultra form factor (Pico-ITX) SBC—MIO-3260 with Intel Celeron Quad Core N2930/Atom Dual Core E3825 processor. MIO-3260 supports DDR3L memory up to 8GB, and its fanless design and low power consumption (4...
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