XMC Form Factor SATA SSD for Industrial, Defense Applications
Microsemi Corporation announced an ANSI/VITA 42.3-2014-compliant PCI Express interface XMC form factor serial advanced technology attachment (SATA) solid state drive (SSD) for industrial and defense applications where ultimate security for data-at-rest is required...
UTC-300P Series POS System with 16:9 Widescreen Display for Diverse Applications
Advantech introduced the new UTC-300P series point-of-sale (POS) system, a multi-purpose all-in-one computing system. Equipped with an IP65-certified 15.6”/18.5” 16:9 widescreen display, this bezel-free, fanless, and slim POS system provides the ideal solution for various retail and hospitality applications and functions...
Latest Family of eXtreme Low Power PIC MCUs
Microchip Technology announced the expansion of its eXtreme Low Power (XLP) PIC microcontroller (MCU) portfolio. Features of the new PIC24F “GB4” family include an integrated hardware crypto engine with both OTP and Key RAM options for secure key storage, up to 256 KB of Flash memory and a direct drive for segmented LCD displays, in 64-, 100- or 121-pin packages...
New Widescreen Ultra-sensitive Touch-Panel Computer for Wide Range of Temperatures
To satisfy an ever increasing demand for widescreen panel computers Advantech announced the release of its new 10.1” and 15.6” TPC-1051WP and 1551WP ultra-sensitive ouch-panel computers. These models are the latest of their type to use the Intel Atom E3827 1...
New Memeber of AAEON’s Infotainment Panel Portfolio: ACP-1104
AAEON announces its latest member of the ACP panel series family, the ACP-1104. This new panel PC features the ever-popular 10.1” projected capacitive multi-touch screen with7H scratchproof glass for added protection. Its ultra-slim profile is much sought after for ease of mounting onto walls or other vertical surfaces...
New high temperature adhesives and encapsulants for applications up to +250 °C
DELO Industrial Adhesives presents new one-component epoxy resins based on anhydrides with an operating temperature range of -65 °C to +250 °C. They are particularly suitable for bonding or encapsulating sensors and semiconductors...
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