Technology front
Full Array of Platforms Sopporting Intel Xeon E5-2600 V3 Product Family
By
Published: Sep 09,2014


Industry's First Haptic + Bluetooth Kit Enables Haptics to Go
Texas Instruments (TI) introduced the industry's first wireless haptic development kit, providing system designers with a fast and convenient way to prototype eccentric rotating mass (ERM) motor and linear resonant actuator (LRA) haptic effects...

Combo Chip Doubles Wi-Fi Performance for High-end Smartphones and Tablets
Broadcom Corporation announced the industry's most powerful 5G WiFi (802.11ac) 2x2 Multiple Input Multiple Output (MIMO) combo chip for mobile devices. The BCM4358 delivers unparalleled throughput, Bluetooth co-existence performance and indoor location accuracy, enabling OEMs to design high-end smartphones and tablets with twice the Wi-Fi performance...

Primary-Side Switcher Cuts Power Supply Size and Cost While Improving Efficiency and Performance
Diodes Incorporated introduced the AP3988 off-line, side-switching controller designed to cut costs and improve power supply performance in chargers, ADSL adapters and home appliance supplies. By providing primary-side control, the device eliminates the requirement for opto-couplers and secondary-side control circuitry, reducing component count, board space requirements and cost...

First High-Temperature MEMS Gyroscope Improves Productivity of Oil and Gas Drilling Equipment
Analog Devices, Inc. introduced the first and only MEMS gyroscope specified to withstand temperatures of up to 175 degrees Celsius commonly encountered by oil and gas drilling equipment. The ADXRS645 MEMS (micro-electromechanical) gyroscope provides excellent vibration immunity and a minimum rotational measurement range of ±2...

Best-in-Class Femto/Picoammeters and Electrometers for Research and Development of New Materials
Keysight Technologies, Inc. introduced the B2980A Series of femto/picoammeters and electrometers, the world’s first graphical picoammeters and electrometers to confidently measure down to 0.01 fA which is 0.01 x 10-15 A, and up to 10 petaohms (PΩ) which is 10 x 1015 ohms...

Highly Efficient, Scalable Core Sets a New Standard in 64-Bit Processing
Imagination Technologies announces the highly-efficient MIPS I-class I6400 CPU family, the first IP cores to combine a 64-bit architecture and hardware virtualization with scalable performance through multi-threading, multi-core and multi-cluster coherent processing...
Top Stories
Most Popular
- 1STM Reveals New Antenna-matching RF Integrated Passive Devices for STM32WL MCUs
- 2HOLTEK HT32 Series Conforms to the UL/IEC 60730-1 Class B Software Security Certification
- 3u-blox’s Newest Module Stands Temperatures up to 105 °C for Advanced Automotive Applications
- 4u-blox Introduces the Smallest LTE-M/NB-IoT Module with 23dBm RF Output Power
- 5Toshiba Launches 100V High-Current Photorelay for Industrial Equipment
- 6u-blox Extends Reach of Secure LTE-M, NB-IoT Module with 400MHz Support
- 7VIAVI First to Introduce RedCap Device Emulation, Boosting 5G IoT Commercialization
- 8DKSH Partners with Life Science Innovator Nicoya in Asia
- 9HOLTEK New BP66FW1242 Wireless Charger Rx MCU
- 10World’s Smallest Plug-and-play NFC Security Module