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Samsung Strengthens Its Foundry Customer Support With New SAFE Foundry Ecosystem Program (2018.01.25)

Samsung Electronics has announced today its continued commitment to first-pass silicon success for its foundry customers’ chip designs by launching the Samsung Advanced Foundry Ecosystem (SAFE) program. (圖一) The SAFE program ensures deep collaboration between the Samsung Foundry...

GUC Celebrates Two Decades of Innovation & Lofty Dreams (2018.01.22)

HSINCHU, Taiwan - Global Unichip Corporation (GUC) today celebrates its 20th anniversary with a party at its Hsinchu, Taiwan headquarters themed around "Celebrate Two Decades of Innovation and Lofty Dreams". The company was established on January 22, 1998...

GUC Celebrates Two Decades of Innovation & Lofty Dreams (2018.01.22)

HSINCHU, Taiwan - Global Unichip Corporation (GUC) today celebrates its 20th anniversary with a party at its Hsinchu, Taiwan headquarters themed around "Celebrate Two Decades of Innovation and Lofty Dreams". The company was established on January 22, 1998...

Samsung Electronics Starts Producing Industry’s First 16-Gigabit GDDR6 (2018.01.18)

Samsung Electronics today announced that it has started mass production of the industry’s first 16-gigabit (Gb) Graphics Double Data Rate 6 (GDDR6) memory for use in advanced graphics processing for gaming devices and graphics cards as well as automotive...

Samsung Electronics Starts Producing Industry’s First 16-Gigabit GDDR6 (2018.01.18)

Samsung Electronics today announced that it has started mass production of the industry’s first 16-gigabit (Gb) Graphics Double Data Rate 6 (GDDR6) memory for use in advanced graphics processing for gaming devices and graphics cards as well as automotive...

China’s Production Capacity of 300mm Wafer Will Approach 700,000 Pc/Month, Says TrendForce (2018.01.17)

According to TrendForce’s latest report, Breakdown Analysis of China’s Semiconductor Industry, many fabs are being built in China with high capital expenditures, attracting attention from the industry. In particular, new fab construction projects like Silan Microelectronics and CanSemi etc...

China’s Production Capacity of 300mm Wafer Will Approach 700,000 Pc/Month, Says TrendForce (2018.01.17)

According to TrendForce’s latest report, Breakdown Analysis of China’s Semiconductor Industry, many fabs are being built in China with high capital expenditures, attracting attention from the industry. In particular, new fab construction projects like Silan Microelectronics and CanSemi etc...

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