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More ICs Solutions

Vishay’s Ultra-Precision Thin Film Chip Resistor with Low TCR of ± 2 ppm/°C (2016.11.01)

Vishay Intertechnology introduced a new ultra-precision thin film chip resistor that offers a dramatic improvement in TCR and tolerance over previous-generation devices. Available in five case sizes from 0603 to 2512, the Vishay Dale Thin Film PLTU offers a tight TCR of ± 2 ppm/°C and tolerance of ± 0...

TI Unveils the Industry's First Single-chip 60-V eFuse with Reverse Polarity Protection (2016.11.01)

Texas Instruments (TI) introduced the first single-chip eFuse with back-to-back FETs, providing the industry's highest rating of protection at up to 60 V. Offering on-chip advanced features including reverse polarity protection and reverse current blocking, the TPS2660 is the most integrated eFuse on the power management market for 24-V and 48-V rail applications in industrial, automotive and communication infrastructure designs...

Toshiba New Stepping Motor Driver IC Lowers Motor Noise and Vibration (2016.10.31)

Toshiba Corporation's Storage & Electronic Devices Solutions Company today announced the launch of “TB67S209FTG”, a stepping motor driver with an architecture that lowers noise and vibration during motor operation. Mass production is slated to begin at the end of December...

Imec Reports Breakthrough Work that Advances Path for Nanoscale Spin-Wave Majority Gates (2016.10.31)

At the Annual Conference on Magnetism and Magnetic Materials, imec presented breakthrough results supporting the building of technology-relevant majority gates based on spin waves. Reporting two industry-first achievements that are crucial for ultralow-power beyond-CMOS technology...

12A Ultrathin µModule Regulator Configurable as Quad, Triple, Dual or Single Output (2016.10.28)

Linear Technology Corporation introduces the LTM4643 quad output step-down µModule (power module) regulator, configurable as a single output (12A), dual (6A & 6A or 9A & 3A), or quad (3A each) regulator in a 9mm x 15mm x 1.82mm ultrathin LGA package...

Industry’s First Automotive-Grade LIN System-in-Package Solution (2016.10.27)

The industry’s first automotive-grade Local Interconnect Network (LIN) System-in-Package (SiP) solution including a microcontroller with integrated touch hardware support is now available from Microchip Technology. The SAMHA1GxxA microcontroller family contains capacitive touch hardware support, an event system and complex PWM capability...

UMC Reports Q3 Revenue of 3.2% Growth and Looks Forward Its 12" Fab in Xiamen, China (2016.10.26)

TAIPEI, Taiwan - United Microelectronics Corporation (UMC) today announced its consolidated operating results for the third quarter of 2016. Third quarter consolidated revenue was NT$38.16 billion, up 3.2% quarterly from NT$37 billion in 2Q16 and an increase of 8...

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