Infineon Technologies AG launches a new family of discrete IGBTs. The new RC-E devices are cost optimized and specifically meet the demands of low- to mid-price range induction cookers and induction rice cookers. The new RC-E family features an IGBT with monolithically integrated reverse conduction diode for resonant switching...

STMicroelectronics (STM) introduced its new record-breaking STM32H7 series of microcontrollers, which embeds the highest SRAM memory (1Mbytes), Flash memory up to 2MB, and the richest connectivity peripheral set ever seen in the STM32 platform...

PiBond today announced that its SAP’s metal oxide solution revolutionizes the way in which manufacturers deal with ever increasing cost structures resulting from more complex designs. These materials boast higher etch selectivity than anything currently on the market...

Samsung Electronics announced that it is introducing the industry’s first 8-gigabyte (GB) LPDDR4 (low power, double data rate 4) mobile DRAM package, which is expected to greatly improve mobile user experiences, especially for those using Ultra HD, large-screen devices...

IC Insights has raised its IC market forecast for 2016 by three percentage points from a 2% decline to a 1% increase and its 2016 IC unit volume shipment growth rate forecast from 4% to 6%. A large portion of this revision is due to a strengthening DRAM market...

Knowles, Goertek and AAC ranked as the top three global suppliers of packaged MEMS microphones for 2015, according to IHS Markit. MEMS (micro-electromechanical systems) technology is utilized to produce microphones used in laptops, hearing aids, wearables and smartphones among many other products...

TAIPEI, Taiwan – As the biggest IC foundry in the world, TSMC has most leading tech companies in its hand, and that is why TSMC’s project of the market trend is so important to technology industry. Recently, TSMC had pointed out that smartphones...