Taipei, Friday, Jul 04, 2025, 03:59
Home | News | Products | Semiconductor | LED | Green Tech | IoTs | IPC

Technology front

Highly Integrated NFC Sensor Transponder for Industrial, Medical, Wearables and IoT Applications

By
Published: Dec 11,2014

 

u-blox Launches Indoor/Outdoor Positioning Module NEO-M8L with Integrated 3D Sensors

Swiss u-blox introduces the NEO-M8L Automotive Dead Reckoning (ADR) module with integrated motion, direction and elevation sensors. The module integrates gyro and accelerometer with u-blox’ GNSS platform u-blox M8 to achieve the highest- performance indoor/outdoor positioning solution available, perfect for all road vehicle and high-accuracy navigation applications...

New 1.2kV, 120A Half-Bridge Module for 30-60kW Power Conversion Systems

Cree announces the release of a new 1.2kV 120A half-bridge module (CAS120M12BM2) that brings game-changing SiC-based performance and system-level cost savings to 30 kW - 60 kW power conversion systems. Powered by C2M MOSFET technology, the new module offers an industry low 2...

New LPDDR4 Verification IP Accelerates Verification Closure for High-Performance Low Power Designs

Synopsys announced the immediate availability of verification IP (VIP) for LPDDR4. Synopsys VIP for LPDDR4 is based on a 100 percent native SystemVerilog Universal Verification Methodology (UVM) architecture to enable ease of use, ease of integration and performance...

Next Generation Open Switch Pipeline Supports Carrier Network Applications

Broadcom announced its next generation OpenFlow Data Plane Abstraction (OF-DPA) version 2.0 reference platform that includes OpenFlow software, specification and APIs, optimized for use in carrier networks and datacenter applications...

World's First DRAM-less NVMe SSD Controller for Mass Market Mobile Computing Solutions

Marvell announced the world’s first DRAM-less NVMe (Non-Volatile Memory Express) solid state drive (SSD) controller for mass market mobile computing solutions with industry-leading NANDEdge low-density parity check (LDPC) technology supporting triple-level cell (TLC) and 3D NAND...

Latest Release of IC Compiler II Broadens Availability of the Power of 10X

Synopsys announced availability of the 2014.12 release of its new IC Compiler II place and route solution. Unveiled at the Synopsys Users Group (SNUG) Silicon Valley in March 2014, IC Compiler II is the game-changing successor to IC Compiler, the industry's leading place and route solution for advanced designs at established and emerging nodes...

[First page][On 10 page][Previous]     301  302  [303]  304  305  306  307  308  309  310   [Next][Next 10 page][Last]

Top Stories

top pic

Kandou Launches World's First Small Form Factor PCIe Transport Layer Switch

Most Popular