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New Stud-Mount Version of Edgewound Power Resistor

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Published: Oct 24,2014

 

New Generation DUSLIC XS Provides Single or Dual Voice Lines in Home CPE

Lantiq announced its next generation voice line termination chip for customer premise equipment (CPE) designs. Continuing a track record of innovation, the new DUSLIC™XS reduces the cost for CPE manufacturers to provide wid...

New UXA Signal Analyzer Delivers Phase Noise, Real-Time Bandwidth and Analysis Bandwidth

Keysight Technologies, Inc. t announced the new flagship of its X-Series: the N9040B UXA signal analyzer. The UXA delivers industry-leading phase noise performance as well as 510-MHz analysis and real-time bandwidths. Combining these three capabilities with a large display and touch-driven interface, the UXA provides wider, deeper views of elusive wideband signals—known or unknown...

Pre-Wired LED Chip-On-Board Array Holders Deliver Industry Leading Electrical and Thermal LED Connec

Molex Incorporated announced its first SlimRay Pre Wired LED Chip-On-Board (COB) Array Holders reduce assembly time while increasing reliability, with compression contacts that eliminate hand soldering and simplify the LED installation process...

New Digitally Enhanced Power Analog Controllers Offer Digital Power Supply Flexibility

Microchip Technology Inc., announced its latest Digitally Enhanced Power Analog (DEPA) controllers—the MCP19118 and MCP19119 (MCP19118/9). They provide simple yet effective analog PWM control for DC-DC synchronous buck converters up to 40V, with the configurability of a digital MCU...

New TDA3x Processor Delivers Cost Effective ADAS SoC for Front, Rear and Surround View Applications

Texas Instruments (TI) is introducing the newest member of the automotive system-on-chip (SoC) family, the TDA3x solution. The TDA3x processor family is designed to help car manufacturers develop sophisticated advanced driver assistance systems (ADAS) applications that meet or exceed NCAP requirements, reduce collisions on the road and enable a more autonomous driving experience in entry- to mid-level automobiles...

New Chipset for DSL Infrastructure Delivers Faster Broadband over Installed Copper Cabling

Broadcom Corporation introduced a new chipset that will enable operators and service providers to deliver Gigabit performance over currently installed twisted pair copper cabling. Built on Broadcom's field-proven central-office DSL technology, the BCM65200 DSP and BCM65900 analog front end family of chipsets are the industry's highest density G...

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