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New HT56RU25 e-Banking Smart Card Reader MCU

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Published: May 02,2014

 

Industry's First Power Device Analyzer for Power Circuit Design

Agilent Technologies introduced the industry's first power device analyzer for circuit design. The Agilent B1506A is a single-box solution that automatically characterizes all power device parameters across a wide range of operating conditions and temperatures (-50 °C to +250 °C), at up to 1500 amps and 3 kV...

New High Performance Conduction Cooled COTS Power Sources

Powerstax, specialist provider of highly optimized power sources, has just added 2 new switch-mode COTS DC-DC power supply units to its portfolio which are designed to cope with even the most demanding application environments...

New SDXC UHS-I Speed Class 3 (U3) Cards From ADATA

TAIPEI, Taiwan — ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, has announced the launch of XPG and Premier Pro series SDXC UHS-I Speed Class 3 (U3) memory cards...

Next-Generation Mobile APUs Add Cutting-Edge Features and Enhanced Security

AMD announced its 3rd-generation Mainstream and Low-Power Mobile Accelerated Processing Units (APUs). Combining category-leading compute performance with unique features and rich user interactions, the 2014 AMD Mainstream and Low-Power Mobile APUs (formerly codenamed “Beema” and “Mullins,” respectively) are the ideal choice for consumer and commercial client devices alike...

Plateau HS Dock+ Connector System offers 150% speed improvement

Molex introduces the Plateau HS Dock+ Connector System for networks that require higher data rates with superior signal integrity to meet the growth in networking and wireless device markets. Plateau HS Dock+ high-speed docking connectors have an innovative, plated-plastic housing for outstanding signal integrity (SI) performance and multiple options for application design flexibility...

30 V, 12 V VGS P-Channel MOSFET Offers Industry's Lowest RDS(ON) in Its Class

Vishay Intertechnology introduced a new -30 V, 12 V VGS p-channel TrenchFET power MOSFET in the ultra-compact, thermally enhanced PowerPAK SC-70 package. With the industry's lowest on-resistance at -4.5 V and -2.5 V gate drives for a -30 V device in the 2 mm by 2 mm footprint area, the SiA453EDJ is designed to save space and increase power efficiency in portable electronics...

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