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New Power Module Breaks Price-Performance Barrier in Power Conversion Systems
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Published: May 22,2014
USB μModule Isolator with Power Protects Hubs & Peripheral Ports
Linear Technology Corporation introduces the LTM2884, a USB μModule (micromodule) Isolator that combines USB data communications and USB power, and guards against ground-to-ground differentials and large common mode transients...
Industry’s Lowest Power Quad-Channel, Jitter Attenuating, Clock Translator
Analog Devices, Inc. introduced the AD9554 multi-service adaptive quad-channel clock translator with clock multiplier, which provides jitter cleanup and synchronization for many systems, including synchronous optical networks (SONET/SDH)...
Industry’s First Integrated Bidirectional 3.4MHz I2C Isolator
Akros Silicon Inc., announces the AS1705 digital isolator. Optimized to enable real-time telemetry and control of Power Sourcing Equipment (PSE) controllers used in Power-over-Ethernet capable (PoE) switches and routers, the AS1705’s 3...
Minitek Pwr 3.0 & Minitek Pwr 4.2 Wire-to-Board and Wire-to-Wire Connectors
FCI’s Minitek Pwr 3.0 is designed for power applications with current ratings of up to 5A per contact. Engineered for wire-to-wire and wire-to-board applications, its crimp and snap-in receptacles are used to terminate AWG 20 to 30 wires...
Next Gen Re-Programmable 2-Wire Hall Effect Switches Simplify System Design Implementation
Melexis Technologies NV announces the introduction of the MLX92242, the latest addition to the company’s advanced Hall effect switch/latch IC offering. Every one of these highly integrated devices contain a voltage regulator (supporting a wide operating voltage range), as well as Hall sensing element and a current sink-configured output driver, all in a single compact, low-profile package...
New Integrated Solution for Rapid Die-Package Interconnect Planning
Cadence Design Systems announced a new integrated solution to significantly cut down die-package interconnect planning time from weeks to days by reducing iterations between silicon and package design teams. The solution, built on Cadence OrbitIO technology, also shortens the time to converge on the physical interface between the die and package up to 60 percent, all within the context of the full system...
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