Technology front
Toshiba Launches Photorelays in New Package for High-density Mounting
By
Published: Sep 14,2020
Renesas Introduces DDR5 Data Buffer for High-Performance Server and Cloud Service Applications
Renesas Electronics announced a new high-speed, low-power DDR5 data buffer for data center, server, and high-performance workstation applications. Advancements over the past few years in real-time analytics, machine learning, HPC, AI, and other memory and bandwidth-hungry applications have fueled explosive growth in server memory bandwidth requirements...
STMicroelectronics Reveals Fast-Starting Intelligent Power Switches for Demanding Safety Application
STMicroelectronics has added new fast-starting devices to its family of intelligent power switches for safety-instrumented systems. With power-on delay time of less than 60µs, the IPS160HF and IPS161HF satisfy standardized requirements for interface types C and D in Safety Integrity Level (SIL) Class 3 applications...
Avalue Bringing 3.5-inch Embedded SBCs, ECM-APL, ECM-APL2-A & ECM-APL2-B
Avalue Technology is bringing the new embedded single board computers, ECM-APL, ECM-APL2-A & ECM-APL2-B, which is equipped with the Intel Apollo lake processor to the market. These new SBCs are designed for dealing with the rising demands on low cost, light weight and system performance and expect to offer users a new solution for entry applications...
ST Eases Design of Advanced Energy-Saving Power Supplies with Eco-Certified 400W Evaluation Board
STMicroelectronics’ EVL400W-EUPL7 evaluation board delivers a ready-to-use 400-Watt power-supply solution that meets today’s toughest eco-design norms. The board leverages innovative features of ST’s L4984D current-mode PFC controller and L6699 resonant half-bridge controller to maximize energy efficiency in multiple operating modes...
HOLTEK New BM25S2021-1 Resistive Temperature and Humidity Digital Sensor
Holtek announced its new Temperature and Humidity Digital Sensor, the BM25S2021-1, a device which includes fully integrated humidity and temperature sensors. After temperature and humidity calibration and temperature compensation is carried out, the module has the characteristics of high precision, low power consumption and ease of use, thus greatly reducing product development time...
Low-Profile Surface-Mount Schottky Diodes from STMicroelectronics Boost Power Density and Efficiency
STMicroelectronics has launched 26 new Schottky diodes in low-profile SMA and SMB Flat packages, covering voltage ratings from 25 to 200V and current ratings from 1 to 5A. The 1.0mm-high devices have 50% lower profile than diodes in standard SMA and SMB packages, enabling designers to increase power density and save space...
Top Stories
Most Popular
- 1STM Reveals New Antenna-matching RF Integrated Passive Devices for STM32WL MCUs
- 2HOLTEK HT32 Series Conforms to the UL/IEC 60730-1 Class B Software Security Certification
- 3u-blox’s Newest Module Stands Temperatures up to 105 °C for Advanced Automotive Applications
- 4u-blox Introduces the Smallest LTE-M/NB-IoT Module with 23dBm RF Output Power
- 5u-blox Extends Reach of Secure LTE-M, NB-IoT Module with 400MHz Support
- 6Toshiba Launches 100V High-Current Photorelay for Industrial Equipment
- 7VIAVI First to Introduce RedCap Device Emulation, Boosting 5G IoT Commercialization
- 8DKSH Partners with Life Science Innovator Nicoya in Asia
- 9HOLTEK New BP66FW1242 Wireless Charger Rx MCU
- 10World’s Smallest Plug-and-play NFC Security Module