ST and Sensory Collaborate to Enable Mass-market Adoption of Embedded Voice
STMicroelectronics and Sensory Inc have announced a collaboration that will enable the STM32 microcontroller (MCU) user community to develop and prototype intuitive voice-based user interfaces for a wide range of smart embedded products...
AUO Recognized with Manufacturing Leadership Awards
Hsinchu, Taiwan – AUO announced that it has been recognized by the Manufacturing Leadership Awards (MLA) in categories of Digital Network Connectivity as well as AI and Machine Learning, and especially honored the High Achiever in Sustainability and the Circular Economy category by the National Association of Manufacturers (NAM) in the US...
MediaTek to Open New IC Design Center at Purdue University in Indiana
MediaTek announced their commitment to accept a state transition assistance package from the Indiana Economic Development Commission (IEDC) to support its very first Midwest semiconductor chip design center in West Lafayette, Indiana...
GlobalWafers to Establish a New 300mm Wafer Fab in the US
GlobalWafers announced on July 27th that it is going to establish a 300mm wafer fab in the Taxes Sherman, United State. The company projected that it will start mass production in 2025 to service its big customers including TSMC, Intel, and Samsung...
Imec Reveals Backside Power Delivery with Buried Power Rails for Back
At the 2022 IEEE VLSI Symposium on Technology and Circuits, imec presented the first experimental demonstration of a routing scheme for logic ICs with backside power delivery enabled through nano-through-silicon-vias (nTSVs) landing on buried power rails (BPRs)...
Microsoft’s MR Aids TMUH to Develop Spinal Endoscopic Surgery
TAIPEI, Taiwan - Under the COVID-19 variant pandemic, every related personal need to do the COVID-19 test before surgery in the hospital, and people commonly worry about the risk of being infected, which results in some unurgent surgery and outpatient surgery being canceled...
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