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More ICs Solutions

Faraday Reveals Its Multi-protocol Video Interface IP on UMC 28HPC (2018.12.11)

HSINCHU, Taiwan - Faraday Technology today announced the availability of its multi-protocol video interface IP on UMC 28nm HPC. The solution supports both transmitter (TX) and receiver (RX) featuring a reduced silicon footprint ideal for state-of-the-art panel and sensor interfaces, projectors, MFP, DSC, surveillance, AR and VR, and AI applications...

TSMC to Build a New 200mm Fab for Customized Design; 5-nm to Enter Trial Production Next Year (2018.12.07)

TAIPEI, Taiwan - C.C. Wei, CEO and vice chairman of TSMC, said at its supply chain management forum held in Hsinchu, Taiwan, that TSMC's 5nm process is expected to enter trial production in the second quarter of next year. In addition, TSMC will establish a new 8-inch(200mm) fab to meet the requirements of the customized design...

TSIA: AI Will Drive Continual Prosperous Development of Taiwan’s IC Industry (2018.11.28)

HSINCHU, Taiwan - Taiwan Semiconductor Industry Association (TSIA) in Hsinchu held the 2018 Taiwan Semiconductor Industry Convention, which was hosted by Taiwan Semiconductor Manufacturing Company Limited (TSMC) CEO and Vice Chairman C...

IC Insights Announces Top-15 2018 Semi Suppliers Forecast; Samsung Ranks NO.1 (2018.11.13)

IC Insights today released its forecast of top-15 worldwide semiconductor (IC and O-S-D—optoelectronic, sensor, and discrete) sales ranking for 2018. It includes seven suppliers headquartered in the U.S., three in Europe, two each in South Korea and Japan, and one in Taiwan...

IC Insights: Quarterly YoY Growth Slows Substantially for IC Market (2018.11.02)

IC Insights pointed that IC market is expected to enter a period of cyclical “cooling” after an extended period of very strong growth. Figure illustrates the worldwide quarterly year-over-year IC market increases from 1Q through 3Q and IC Insights’ forecast for 4Q of this year...

Samsung Electronics Starts Production of EUV-Based 7nm LPP Process (2018.10.18)

Samsung Electronics today announced that it has completed all process technology development and has started wafer production of its revolutionary process node, 7LPP, the 7-nanometer (nm) LPP (Low Power Plus) with extreme ultraviolet (EUV) lithography technology...

M31 Technology’s Diversified TSMC 28HPC+ ULL Memory Compilers (2018.10.02)

HSINCHU, Taiwan - M31 Technology today announced that it has developed a diversified TSMC 28HPC + Ultra-Low Power (ULL) Memory Compiler IP portfolio that provides customers with more flexibility in their SoC design. “TSMC’s 28HPC+ ULL memory bit-cell provides further leakage reduction for mainstream smart phones...

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