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TrendForce Reports Top 10 Foundries for 1H18, TSMC Ranks First with 56.1% Market Share (2018.05.24)

According to TrendForce’s latest report, the premium smartphone market experienced weak demand in 1H18, as the vendors blurred the lines between their mid-range and premium models, and the new devices released did not trigger a high level of replacement demand as anticipated...

Semi Capex Forecast to Exceed $100B for the First Time in 2018 (2018.05.23)

According to IC Insights, overall, the capital spending story for 2018 is becoming much more positive. In the March Update, IC Insights forecast an 8% increase in semiconductor industry capital spending for this year. However, as shown in Figure, IC Insights has raised its expectations for 2018 capital spending by six percentage points to a 14% increase...

Thirteen Top-15 1Q18 Semi Suppliers Register Double-Digit Gains (2018.05.16)

The top-15 worldwide semiconductor (IC and O-S-D—optoelectronic, sensor, and discrete) sales ranking for 1Q18 is shown in Figure. It includes eight suppliers headquartered in the U.S., three in Europe, two in South Korea, and one each in Taiwan and Japan...

CMOS Image Sensor Sales Stay on Record-Breaking Pace, IC Insights Says (2018.05.09)

The spread of digital camera applications in vehicles, machine vision, human recognition and security systems, as well as for more powerful camera phones will drive CMOS image sensor sales to an eighth straight record-high level this year with worldwide revenues growing 10% to $13...

Q1 2018 Taiwan IC Revenue Totaled NT$603.2 Billion, Up 5.6% on-year (2018.05.03)

The TSIA survey showed that Q1 2018 Taiwan IC revenue as a whole (including design, manufacturing, packaging and testing) totaled NT$603.2 billion(US$19.8B) (10.7% decline on-quarter and up 5.6% on-year), with NT$137.2 billion in design(US$4...

Synopsys and TSMC Collaborate to Deliver Ultra-Low Power TSMC 22-nm Processes (2018.05.01)

Synopsys announced its collaboration with TSMC to develop DesignWare Foundation IP for TSMC's 22-nanometer (nm) ultra-low power (ULP) and ultra-low leakage (ULL) processes. DesignWare Foundation IP, including logic libraries, embedded memories...

eMemory introduces more security features to its eNVM IP for TSMC 7nm Process (2018.04.27)

HSINCHU, Taiwan – eMemory today announced the successful verification of its secure eNVM IP for TSMC’s advanced processes, and the company is introducing more security features to the eNVM solution for TSMC’s 7nm process technology in the coming months...

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