Taipei, Sunday, Apr 23, 2017, 17:47

More ICs Solutions

Researchers Create Practical and Versatile Microscopic Optomechancial Device (2017.01.11)

Researchers have developed a new type of optomechanical device that uses a microscopic silicon disk to confine optical and mechanical waves. The new device is highly customizable and compatible with commercial manufacturing processes, making it a practical solution for improving sensors that detect force and movement...

Imec and Besi Demonstrate Long-Term Reliability of Ni-Cu-Ag Plated Solar Modules (2017.01.03)

imec and BE Semiconductor Industries N.V. (Besi), a leading manufacturer of assembly equipment for the semiconductor industry, announced that they have demonstrated long-term reliability in five full size 60-cells Nickel/Copper/Silver (Ni/Cu/Ag) plated solar cell modules, confirming the industrial value of this metallization technology...

TrendForce Expects NAND Flash Prices to Keep Rising During 2017 (2016.12.21)

The global NAND Flash industry will see an annual increase of just 6% in its total wafer capacity in 2017, according to analysis by DRAMeXchange, a division of TrendForce. DRAMeXchange noted, as the pace of the industry-wide transition to 3D-NAND architecture accelerates, supply of 2D-NAND memory will drop sharply, leading to shortages next year...

Memory Market to Increase 10% in 2017, IC Insights Says (2016.12.21)

According to IC Insights, the total memory market still down 1% yearly in 2016, and will increase 10% in 2017 to a new record high of $85.3 billion as gains in average selling prices for DRAM and NAND flash. IC Insights pointed, after increasing by more than 20% in both 2013 and 2014, the memory market fell upon difficult times in 2015...

Toshiba Expands Line-up of Embedded NAND Flash Memory Products for Automotive Applications (2016.12.20)

Toshiba Corporation’s Storage & Electronic Devices Solutions Company announced the launch of JEDEC e∙MMC Version 5.1 compliant embedded NAND flash memory products supporting AEC-Q100 Grade2 requirements. The line-up offers densities of 8GB, 16GB, 32GB and 64GB...

China’s National IC Fund to Focus on Fabless IC Design (2016.12.19)

China’s National Integrated Circuitry Investment Fund (here referred to as “National IC Fund”) has committed to invest nearly RMB 70 billion into the domestic semiconductor sector since its creation in 2015. Approximately 60% of the committed investment amount has been allocated to building semiconductor wafer fabs, according to TrendForce’s analysis...

Only DRAM Suppliers and Top Foundries Use 300mm Wafers (2016.12.19)

According to IC Insights’ latest report, number of IC manufacturers using 300mm wafers less than half using 200mm wafers, and is becoming top-heavy. IC Insights said, prior to 2008, the 200mm wafer was used in more cases for manufacturing ICs than any other wafer size...

[Previous]     1  2  3  [4]  5  6  7  8  9  10   [Next][Next 10 page][Last]