Taipei, Monday, May 20, 2019, 23:30


NTU College of Medicine Shares Viewpoint Regarding IBM Watson Bottleneck

Published: May 07,2019


news pic

AAEON Collaborates with Intel to Deliver Powerful Network Solutions: FWS-8600

TAIPEI, Taiwan –AAEON has collaborated with Intel to deliver a powerful network platform utilizing the latest 2nd Generation Intel Xeon Scalable processors. The result of this effort is the FWS-8600 2U rackmount network appliance, the most powerful network appliance from AAEON yet...

news pic

Semiconductor Companies Leading in AI, GlobalData Says

Apple, Google, and Tesla are among the leading chip companies in artificial intelligence (AI), according to GlobalData’s Thematic scorecard for the semiconductor sector. GlobalData Head of Thematic Research Cyrus Mewawalla comments, “Companies who invest in the right themes become success stories...

news pic

Over-The-Top STBs Continue to Outperform Cable and IP STBs in 2018

Global shipment volume of cable, IP (Internet Protocol), and OTT (Over The Top) STB (Set Top Box) devices totaled 169 million units in 2018, according to Taipei-based, government-backed research institute MIC (Market Intelligence & Consulting Institute)...

news pic

Top Three China Panel Suppliers Surpass 40% in 1Q Market Share Combined, Says TrendForce

According to the TV panel shipment report for 1Q19 by WitsView, a division of TrendForce, total shipments have reached 70.02 million units, a YoY growth of 4.2%. The first season was an offseason as always with demand clearly dropping...

news pic

New CPU and GPU Rollouts to Trigger Replacement Demand for Gaming NB in 2020: MIC

Global gaming PC market volume is expected to total around 17 million units in 2019, 9.47 million of which will be gaming notebook PCs with 7.8% year-on-year growth while 7.56 million will be desktop PCs with 10.8% year-on-year growth, according to Taipei-based, government-backed MIC (Market Intelligence & Consulting Institute)...

news pic

iST’s Wafer Backend Process is Now IATF 16949 Certified

iST announced today that iST’s wafer backend process fab (Hsinchu Science Park Building 2, hereinafter referred as “HSP Building 2”) is now IATF 16949:2016 automotive quality management system certified by third parties...

[Previous]     1  2  3  4  [5]  6  7  8  9  10   [Next][Next 10 page][Last]