Published: Sep 18,2019
New data from Juniper Research has shown that the total transaction value of remote payments for digital and physical goods will exceed $6 trillion by 2024; representing a growth of 53% from 2019. The new research, Mobile & Online Remote Payments for Digital & Physical Goods: Opportunities...
Infineon Technologies has started a collaboration with. Next-generation AURIX microcontrollers from Infineon will integrate a new high-performance AI accelerator called Parallel Processing Unit (PPU) that will employ Synopsys' DesignWare ARC EV Processor IP...
TAIPEI, Taiwan - Bitcoin.com and telecommunications manufacturer HTC have announced the beginning of a long-term, mutually beneficial partnership to drive innovation and adoption of crypto technologies. HTC is known for pushing the boundaries of technology with cutting edge, futuristic smartphones, and they have done it again...
HSINCHU, Taiwan – AU Optronics Corp. today announced that the Company has been named to Dow Jones Sustainability World Index (DJSI World) for ten consecutive years, standing out for its sound corporate governance and sustainability performance...
STMicroelectronics has been chosen to supply high-efficiency silicon-carbide (SiC) power electronics by Renault-Nissan-Mitsubishi (Alliance) for advanced on-board chargers (OBCs) in its upcoming electric vehicles. Renault-...
TAIPEI, Taiwan - The world’s third largest machine tool group, Fair Field Group, on September 9 in Bengaluru, India’s international Hardware Aerospace and IT Park, celebrated the opening ceremony of the FFG MAG India Industrial Automations Systems Pvt...
- 1Acer Notebook Designs, Including New ConceptD Creator Models, Win 2019 Good Design Awards
- 2MOST Taiwan Tech Arena Leads 12 Medical Startups for the MedTech Conference 2019
- 3Taiwan’s Communications Industry Output Value Increases 1.1% to NT$3.6 Trillion in 2019
- 4FarEasTone to Launch Taiwan’s First 5G IoT Open Trial Field
- 5Andes Technology, Tiempo Secure Announce Strategic Partnership to Enhance RISC-V Platform Security
- 6Alibaba Unveils Its Self-Developed AI Chip “Hanguang 800”
- 7BITO Robotics Utilizing AI Algorithms in Smart Manufacturing
- 8Samsung Develops 12-Layer 3D-TSV Chip Packaging Technology with Over 60,000 TSV Holes
- 9M31 Won TSMC’s 2019 Partner of the Year Award for Specialty Process IP
- 10Seizing the $152.1B Gaming Market – COMPUTEX Creates a E-Sports Equipment Ecosystem