Taipei, Friday, Dec 06, 2019, 14:12


Fingerprint Cards Unveils New Slim Side-mounted Capacitive Sensor for Mobile Devices

Published: Nov 20,2019


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Cree and STMicroelectronics Expand and Extend Existing Silicon Carbide Wafer Supply Agreement

Cree and STMicroelectronics announced today the expansion and extension of an existing multi-year, long-term silicon carbide (SiC) wafer supply agreement to more than $500 million. The extended agreement is a doubling in value of the original agreement for the supply of Cree’s advanced 150mm silicon carbide bare and epitaxial wafers to STMicroelectronics over the next several years...

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Asia/Pacific Spending on Security Solutions Projected to Reach 16.4 Billion in 2019

According to the latest IDC Worldwide Semiannual Security Spending Guide, spending on security hardware, services, and software in Asia/Pacific is expected to reach USD 16.4 billion in 2019, an increase of 20.01% over previous year...

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Chen Liang-gee Meets NVIDIA Chief Scientist William J. Dally to Deepen AI Cooperation

TAIPEI, Taiwan - Taiwan’s Ministry of Science and Technology (MOST) has teamed up with NVIDIA once again following NVIDIA's response to MOST’s AI research strategy, and after jointly proposing five major directions for cooperation, MOST invited NVIDIA Senior Vice President and Chief Scientist William J...

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Faraday and UMC Collaborate to Launch a Complete Set of 22nm Fundamental IP

HSINCHU, Taiwan - Faraday Technology and United Microelectronics Corporation, today announced the availability of Faraday’s fundamental IP on UMC’s 22nm ultra-low-power (ULP) and ultra-low-leakage (ULL) processes. The silicon-proven 22ULP/ULL fundamental IP, including multi-Vt standard cell libraries, ECO libraries, IO libraries, PowerSlash kit, and memory compilers, offers significant power reduction for the next level of SoC design...

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Demand for Preemptive 3Q19 DRAM Shipment Rises, Pushing Global DRAM Revenue Up by 4%

According to the DRAMeXchange research division of TrendForce, demand-side inventory in 2H19 has returned to relatively healthy levels. Furthermore, some vendors pulled their quarterly product shipment forward in an effort to avoid potential negative impacts from Trump’s impending tariffs; this shift skyrocketed DRAM suppliers’ sales bits in 3Q19...

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TSIA Q3 2019 Statistics on Taiwan IC Industry

The TSIA survey showed that Q3 2019 Taiwan IC revenue as a whole (including design, manufacturing, packaging and testing) totaled NT$721.7 billion(US$23.9B) (15.4% growth on-quarter and up 4.4% on-year). With NT$186.0B in design(US$6...

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