Published: Aug 10,2017
Würth Elektronik eiSos offers an addition to its “Wire Protection System WR-TBL” product family: Series 8050 is a horizontal entry clamp in 2.5-mm pitch, available either as a two or three-pole version. What makes this component unique is its combination of properties: perfect for pure SMT assembly without drilling, extremely small (5 mm high) and these parts have screwless spring clamping...
Vishay Intertechnology introduced new surface-mount multilayer ceramic chip capacitors (MLCCs) for high frequency RF and microwave applications to offer an operating temperature range to +200 °C. For telecom base stations and military communication systems, the Vishay Vitramon VJ HIFREQ HT series provides ultra high Q and low ESR in four compact case sizes...
Toshiba Memory Corporation Unveils World's First Enterprise SSDs Utilizing 64-Layer, 3D Flash Memory
Toshiba Memory Corporation unveiled the development of the world’s first enterprise SSDs utilizing 64-layer, 3D flash memory. The two new product lines, the PM5 12Gbit/s SAS series and the CM5 NVM Express (NVMe) series, utilize Toshiba Memory Corporation’s BiCS FLASH 3D flash memory, allowing today’s demanding storage environments to expand the use of flash memory with cost-optimized 3D flash memory...
Intel today announces major data center storage advances, new “ruler” form factor SSDs and dual port SSDs. The new technologies advance data center storage and deliver innovative solutions to meet the challenges presented by the growing reliance on data...
Macronix International announced the new Ultra-OctaFlash, following its initial launch in 2015. The new ultra-high performance OctaFlash Memory can perform at an operational frequency of 250MHz with 500MB/s read throughput, the fastest in the industry...
Microsemi announced the availability of its Switchtec PAX advanced fabric Gen3 PCIe switch providing fabric connectivity for scalable, multi-host systems and just a bunch of flash (JBOF) supporting single root input/output (I/O) virtualization (SR-IOV), NVMe and multi-function endpoints...
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