Taipei, Thursday, May 24, 2018, 14:17

Technology front

Color E-paper Display Launched in New 12" Format with Integrated Controller Electronics

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Published: May 08,2018

 

TI's Ultra-small 5.5-V DC/DC Step-down Power Module Delivers True 6-A Performance

Texas Instruments (TI) introduced a 5.5-V step-down power module that delivers true, continuous 6-A output current with up to 95 percent efficiency. The easy-to-use TPSM82480 DC/DC module integrates power metal-oxide semiconductor field-effect transistors (MOSFETs) and shielded inductors into a tiny...

HOLTEK New BS83B24C/BS83C40C High Key Count High Anti-interference Touch MCUs

Holtek announced the release of a new generation of Touch Flash MCUs, the BS83xxxC series. In addition to including all the advantages of the already released BS83BxxA series, this new series contains an improved anti-interference ability that allows them to repel interference from electrical noise sources such as that from power supplies, RF interference, power supply voltage fluctuations etc...

u-blox Announces the First High Precision GNSS Module Based on u blox F9 Technology

u-blox announced the ZED-F9P multi-band GNSS module with integrated multi-band Real Time Kinematics (RTK) technology for machine control, ground robotic vehicles, and high precision unmanned aerial vehicles (UAV) applications...

Samsung Introduces 16Mp ISOCELL Slim 3P9 Image Sensor with a Plug and Play Solution

Samsung Electronics today introduced a new 16-megapixel (Mp) ISOCELL Slim 3P9 image sensor along with a Plug and Play solution, a pre-optimized turnkey camera module made up of an ISOCELL image sensor and preferred partner components to help expedite time-to-market...

AAEON Launches the GENE-APL6 Rugged Subcompact Motherboard for Factory Automation

AAEON launches the GENE-APL6, a rugged subcompact motherboard purpose-built for factory automation and transport applications. Equipped with an Intel Pentium N4200 or Celeron N3350 processor and DDR3L memory, the fanless GENE-APL6 features a solder-up design, which allows for the easy implementation of a heat spreader to channel heat from the CPU out through the chassis...

New 100-Mbps single-pair Ethernet PHY with SGMII

Texas Instruments (TI) introduced a new automotive Ethernet physical layer (PHY) transceiver that cuts the external component count and board space in half and consumes as little as half the power of competitive solutions. The DP83TC811S-Q1's support for serial gigabit media independent interface (SGMII)...

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